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Method for a socket contact design to eliminate a thermal bottleneck

IP.com Disclosure Number: IPCOM000006848D
Publication Date: 2002-Feb-06
Document File: 4 page(s) / 235K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a socket contact design to eliminate a thermal bottleneck. Benefits include improved thermal performance.

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Method for a socket contact design to eliminate a thermal bottleneck

Disclosed is a method for a socket contact design to eliminate a thermal bottleneck. Benefits include improved thermal performance.

Background

   The electrical current through the socket contact increases with the microprocessor power dissipation. When the electrical current flows through the socket contact, the Joule heating effect generates heat on the contact. Cooling of the socket contact mainly relies on the thermal conduction from the contact to the solder ball, then from the solder ball to the motherboard. The heat is eventually dissipated from the motherboard to the surrounding ambient environment by air convection (see Figure 1). The bottleneck of thermal conduction in the socket contact results in a high temperature gradient due to the higher heat flux. The high temperature gradient results in higher overall socket contact temperature that consequently impacts the socket reliability and the maximum current limit.

   The conventional approach is to limit the electrical current through the socket contact so that it does not exceed the maximum temperature.

General description

   The disclosed method is to modify the socket contact design so that the bottleneck in the thermal conduction can be eliminated. The modified contact can reduce the overall temperature of the socket contact and increase the maximum conventional limitation.

   The key element of the method is the socket contact with the modified geometry to eliminate the bottleneck in thermal conduction.

Advantages

              The disclosed method presents several advantages, including:

•             Simple geometric modification on the conventional socket contact

•             No impact on the manufacture process for the socket contact

•             No need to change the socket cover and base (plastic portion) design

•             Significant reduction in the temperature gradient and the overall temperature on the socket contact

              The electrical current limit increases due to the lower overall socket contact temperature.

 


Detailed Description

   The conventional design of the socket contains a bottleneck that is typically formed between the lock-in feature and the pad...