Browse Prior Art Database

Method for a second-level liquid solder thermal solution

IP.com Disclosure Number: IPCOM000006850D
Publication Date: 2002-Feb-06
Document File: 3 page(s) / 18K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a second-level liquid solder thermal solution. Benefits include improved thermal performance.

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Method for a second-level liquid solder thermal solution

Disclosed is a method for a second-level liquid solder thermal solution. Benefits include improved thermal performance.

Background

              With conventional assembly processes, liquid solder does not remain above the heat spreader during operation. As the temperature of the die increases during operation and then cools down, the liquid solder flows out of the interface, resulting in thermal interface material (TIM) pump out. After several cycles, TIM is no longer present in the integrated heat spreader-heatsink interface. No conventional liquid-solder solution exists for this problem.

General description

              This disclosed method enables the use of solders with melting points lower than the operating temperature of the OLGA flip-chip package as second-level thermal interface materials. The disclosed design includes the following components (see Figure 2):

•             Flip-chip package with an integrated heat spreader (IHS)

•             O-ring on the top surface that is bonded or mechanically integrated onto the heat spreader to seal and contain the second-level liquid solder between IHS and the enabling solution or heatsink

•             O-ring that is manufactured from:
              -             Thermoplastic

-         Thermoset

-         B-staged or fully-cured polymer

-         Filled polymer

-         Polymer-solder hybrid

-         Solder

•             O-ring that can be integrated into the heatsink, IHS, or both, if more than one O-ring is implemented in the design

•             O-ring material that exhibits the flexibility to be compressed to reduce in height and seal the TIM between the IHS and heatsink when the TIM solder becomes molten

•             O-ring that reduces/eliminates heatsink tilt

•             B-staged O-ring that can be cur...