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Method of providing mechanical support for a peripheral array BGA package with land-side capacitors to ensure compatibility with a PGA package

IP.com Disclosure Number: IPCOM000006852D
Publication Date: 2002-Feb-06
Document File: 3 page(s) / 20K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method of providing mechanical support for a peripheral ball grid array (BGA) package with land-side capacitors (LSCs) to ensure compatibility with a pin grid array (PGA) package. Benefits include improved functionality and improved reliability.

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Method of providing mechanical support for a peripheral array BGA package with land-side capacitors to ensure compatibility with a PGA package

Disclosed is a method of providing mechanical support for a peripheral ball grid array (BGA) package with land-side capacitors (LSCs) to ensure compatibility with a pin grid array (PGA) package. Benefits include improved functionality and improved reliability.

Background

              Mechanical support is required to prevent a surface-mount package with land-side capacitors from interfering with the motherboard. Compatibility is required between a peripheral row (with a center cavity) surface-mount (BGA) part and a socketable PGA, typically in a mobile segment.

              Conventionally, the problem is solved by placement of die-side capacitors (DSCs) on a BGA substrate.

Description

              The disclosed method provides mechanical support for a surface-mount electronic package assembly with LSCs to prevent bending or warpage while ensuring compatibility between the peripheral row BGA and PGA form factors.

              The key elements include:

•             Peripheral row BGA package with die side capacitors

•             Peripheral row BGA package with land-side capacitors

•             Mechanical support elements

•             Electronic package assembly

•             Motherboard for surface mount application

Advantages

              The disclosed method provides several technical advantages, including:

•             Elimination of die-side capacitors and a assembly process step

•             Implementation of land side capacitors directly under the die for a surface mount package

•             Increased capacitor types to choose from due to reduced limitations on height/FF

•             Potentially reduces number of substrate layers

•             Elimination of LSCs contacting the motherboard as a result of bending/warpage due to enabling loads

•             Ensures pin/ball compatibility between the BGA and PGA parts

 


Detailed description

              In a flip chip ball grid array (FC-BGA) package, the die is flip-chip attached to a substrate...