Browse Prior Art Database

Method for under-board heating and support for pin and no-pin substrates in carriers

IP.com Disclosure Number: IPCOM000006855D
Publication Date: 2002-Feb-06
Document File: 3 page(s) / 20K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for under-board heating and support for pin and no-pin substrates in carriers. Benefits include improved ease of manufacturing.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 50% of the total text.

Method for under-board heating and support for pin and no-pin substrates in carriers

Disclosed is a method for under-board heating and support for pin and no-pin substrates in carriers. Benefits include improved ease of manufacturing.

Background

              Conventionally, heating is applied by a metal post that pushes the package out of the handling media, as shown in Figure 1. The package is held down by vacuum while heat is applied to the underside of the package. Damage to the package occurs if the package is pushed out of the carriers while the springs are in place. The conventional chip-attach machine does not have the capability to compress the springs to enable the package to be pushed out without damaging it. This method of heating cannot be used to support the underside of packages that have land-side caps and pins.

Description

      The disclosed method provides under-board heating and support for pin and no-pin substrates in carriers. The rising heating mechanism has a solid metal wall that stops flushed with the underside of the carrier. The middle contains metal supports that touch the underside of the substrates. Heat can be applied using conduction or convection. Each heating and supporting mechanism is only for one substrate. For a 10-up carrier, 10 mechanisms are required.

      The key elements of the method are:

•             Solid wall that stops flush to the underside of the carrier when activated

•             Center with solid metal support pins for the underside of the substrates

•             Support pins flush with the underside of the substrates when activated

•             Under-board support works...