Browse Prior Art Database

Disclosed is a method for a direct solder attachment of two or more printed circuit boards without a connector

IP.com Disclosure Number: IPCOM000006858D
Publication Date: 2002-Feb-06
Document File: 2 page(s) / 16K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a direct solder attachment of two or more printed circuit boards without a connector. Benefits include improved productivity, improved quality, and improved reliability.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 69% of the total text.

Disclosed is a method for a direct solder attachment of two or more printed circuit boards without a connector

Disclosed is a method for a direct solder attachment of two or more printed circuit boards without a connector. Benefits include improved productivity, improved quality, and improved reliability.

Background

              Market demands require packaging options to reduce the size and volume of circuit assemblies. Standard industry practice is to create multiple circuit boards and mate them using connectors, which are soldered to the board. The connectors add cost to the product and decrease its quality and reliability.

      Interconnection between circuit assemblies is conventionally accomplished by connectors and/or cables. For example, a female connector is solder attached to one circuit board. The second circuit board has edge contacts, which insert into the female connector.

Description

      The disclosed method provides interconnection between printed circuit boards without connectors (see Figure 1). The key elements of the method include:

•             Direct solder attachment of two or more circuit boards

•             No connector

•             Bottom side wave or manual soldering

•             Slot in main circuit board receives daughter card

•             Alignment between boards is achieved through tolerance alignment and retention features

•             Alignment hole or slot that may be plated and subsequently soldered for power delivery or ground return

•             Insertion depth is controlled be daughter card shoulders

•             Main board and daughter card have...