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Method for mounting a fan

IP.com Disclosure Number: IPCOM000006892D
Publication Date: 2002-Feb-08
Document File: 5 page(s) / 260K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for mounting a fan. Benefits include improved cooling, decreased thermal resistance, reduced noise, smaller footprint, and improved heat-transfer coefficient.

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Method for mounting a fan

Disclosed is a method for mounting a fan. Benefits include improved cooling, decreased thermal resistance, reduced noise, smaller footprint, and improved heat-transfer coefficient.

Background

              Conventional finned heatsinks used in electronics package cooling provide a limited heat rejection capability. They lack an efficient heat transfer mechanism. The speed and power capabilities of the electronic circuit modules are severely limited.

              The conventional solution is to use parallel plates or a folded-fins type of heatsink, typically with a single fan (see Figure 1) attached to it, called an active heatsink. The fan hub has a negative effect on the thermal performance of the heatsink because airflow does not circulate well below the hub. Poor air circulation may occur above the hottest region of the heatsink, where the greatest heat transfer coefficients exist and the greatest airflow is most needed (see Figure 2).

              Moving the hub towards the edge of the heatsink improves efficiency. However, moving the fan towards the edge requires the use of two fans, which increases noise.

General description

              The disclosed method consists of a fan mounting that supports two fans for use with active heatsinks. This method enables the delivery of more air to the hottest region of the heatsink - just above processor. Two thick fins support two fans.

              Each fan is fabricated without a case or studs. The fins of the heatsinks are bent to accommodate the use of two fans and provide a non-uniform gap for a higher heat transfer coefficient.

      The disclosed method is also applicable to an active heatsink with a single fan.

              The key elements of this method include: 

•             Thicker fins to support fan without case and studs

•             More air flow circulating over the hottest region of the heatsink (just above the processor)

•             Noise reduction and even more air flow (by using fans with no case and studs)

•             Non-uniform gap for an improved heat-transfer coefficient

•             Increased fin area for the same heatsink footprint

Advantages

              The disclosed method provides several advantages over conventional solutions, including:

•             Improved airflow

•             Improved thermal resistance

•             Noise reduction

•             Increas...