Browse Prior Art Database

Method for an IHS design and second-level thermal BLT control

IP.com Disclosure Number: IPCOM000006893D
Publication Date: 2002-Feb-08
Document File: 3 page(s) / 16K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is an integrated heat spreader (IHS) design and second-level thermal bond-line thickness (BLT) control. Benefits include improved thermal performance and improved reliability.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 52% of the total text.

Method for an IHS design and second-level thermal BLT control

Disclosed is an integrated heat spreader (IHS) design and second-level thermal bond-line thickness (BLT) control. Benefits include improved thermal performance and improved reliability.

Background

      The disclosed method addresses the problem of increasing thermal requirements for flip-chip OLGA packages. To meet thermal targets for increased processor speeds, second-level thermal performance must improve. Adding spacers to the IHS and heatsink interface reduces heatsink tilt and results in tighter BLT control than do particle fillers, which have an increased tolerance for spacers.

              The heatsink BLT is conventionally controlled with filler size in the thermal interface material (TIM).

              Conventional processing steps include:

1.           Dispense TIM onto the IHS.

2.           Pick and place a heatsink onto the IHS.

3.           Clamp the heatsink in place.

Description

      The disclosed method is an IHS and heatsink with one or more .5-10 mil bumps, nodules, or spacers on the top surface of the IHS or the cavity surface of the heatsink. The nodules or spacers reduce/eliminate tilt of the second-level heatsink solution. Stamping and plating the bumps do not complicate the conventional IHS stamping and plating process or increase the unit cost. The spacers could be solder balls, polymer, or any other material with a tightly controlled height.

      The key elements are:

•             The components of the heat spreader are highly conductive materials such as stamped or inj...