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Method for an advanced metal carrier substrate retention mechanism

IP.com Disclosure Number: IPCOM000006894D
Publication Date: 2002-Feb-08
Document File: 3 page(s) / 178K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an advanced metal carrier substrate retention mechanism. Benefits include improved yield and reduced equipment and product damage.

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Method for an advanced metal carrier substrate retention mechanism

Disclosed is a method for an advanced metal carrier substrate retention mechanism. Benefits include improved yield and reduced equipment and product damage.

Background

              Several problems conventionally occur with front-of-line metal packaging media, such as SS carriers (see Figure 1).

•             Surface mounting silicon wafer die and components onto devices with ever decreasing scales within semiconductor packaging.

•             Imprecise placement of land-side capacitors (LSCs) and die-side capacitors (DSCs) because of irregular substrates in the X and Y directions

•             Edge damage to substrates due to spring clip retention, resulting in yield loss due to visual defects

•             Substrate warpage due to spring force

              The spring compression distance is conventionally controlled by adjustments made on the equipment. If the equipment is setup incorrectly, the spring can become hyper-compressed and damaged.

General description

              The disclosed method improves substrate retention within high-volume manufacturing (HVM) media to improve the X/Y positioning of devices.

              The key elements of the method include:

•             Retention mechanism

•             Spring

•             Roller

Advantages

              The disclosed method provides advantages over the conventional solution, including:

•             Trends of reducing die bump, passive component, and other surface mount component size and pitch can continue without sacrificing quality, UPH, or yield.

•             Materials and media tolerances can be loosened, which de...