Browse Prior Art Database

C-5 ON C-5 STANDARD PACKAGE PLATFORM

IP.com Disclosure Number: IPCOM000006954D
Original Publication Date: 1993-Jun-01
Included in the Prior Art Database: 2002-Feb-12
Document File: 1 page(s) / 65K

Publishing Venue

Motorola

Related People

B. Miles: AUTHOR [+3]

Abstract

Motherboard real estate is a valuable commodity that is ever decreasing in current and new radio product designs. This invention will allow for the use of the area over standard chip resistors and capacitors that other- wise may be wasted space in the radio. Typical die sets for a multichip module (MCM) application force the module to occupy an area larger than the I/O footprint requires, due to reduced I/O communication lines needed with the motherboard. Therefore, even though the MCM itself decreases the necessary motherboard real estate, the module area is still larger than is actually required. This invention proposes the use of a standard MCM-L design with all l/O routed to the center of the MCM-L package. This MCM-L can then be interconnected to a PCB motherboard by a standard C-5 platform. The PCB platform board is sized according to the I/O footprint required for the application. The standard MCM-L plat- form board can then be attached to the motherboard using standard C-5 soldering techniques. The resulting package would occupy less real estate on the motherboard than the MCM itself would have required. Additionally, the number of layers in the motherboard would be reduced, because the interconnects will be made in the MCM-I. and the olatform mior to interconnection to the motherboard.

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MOIOROLA INC. Technical Developments Volume 19 June 1993

C-5 ON C-5 STANDARD PACKAGE PLATFORM

by B. Miles, F. Juskey and K. Banerji

  Motherboard real estate is a valuable commodity that is ever decreasing in current and new radio product designs. This invention will allow for the use of the area over standard chip resistors and capacitors that other- wise may be wasted space in the radio. Typical die sets for a multichip module (MCM) application force the module to occupy an area larger than the I/O footprint requires, due to reduced I/O communication lines needed with the motherboard. Therefore, even though the MCM itself decreases the necessary motherboard real estate, the module area is still larger than is actually required. This invention proposes the use of a standard MCM-L design with all l/O routed to the center of the MCM-L package. This MCM-L can then be interconnected to a PCB motherboard by a standard C-5 platform. The PCB platform board is sized according to the I/O footprint required for the application. The standard MCM-L plat- form board can then be attached to the motherboard using standard C-5 soldering techniques. The resulting package would occupy less real estate on the motherboard than the MCM itself would have required. Additionally, the number of layers in the motherboard would be reduced, because the interconnects will be made in the MCM-I. and the olatform mior to interconnection to

the motherboard.

  Additionally, the area under the MC...