Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

LOW PROFILE SURFACE MOUNT VERTICAL MODULAR JACK

IP.com Disclosure Number: IPCOM000006997D
Original Publication Date: 1993-Oct-01
Included in the Prior Art Database: 2002-Feb-15
Document File: 1 page(s) / 56K

Publishing Venue

Motorola

Related People

D. Allan Daggs: AUTHOR [+2]

Abstract

Motorola mobile two-way radios often use an industry standard eight position modular, or tele- phone, style jack for connection of the external micro- phone or other accessories. This allows for the use of standard plugs and coil cords. It is desirable to use this type of connector on new mobile products for backwards compatibility with many of the existing mobile accessories which use this interface.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 69% of the total text.

Page 1 of 1

MO7VROL.A INC. Technical Developments Volume 20 October 1993

@

LOW PROFILE SURFACE MOUNT VERTICAL MODULAR JACK

by D. Allan Daggs and William C. Phelps, Ill

  Motorola mobile two-way radios often use an industry standard eight position modular, or tele- phone, style jack for connection of the external micro- phone or other accessories. This allows for the use of standard plugs and coil cords. It is desirable to use this type of connector on new mobile products for backwards compatibility with many of the existing mobile accessories which use this interface.

  The invention is a low profile surface mount ver- tical modular jack. The unique connector housing was designed to allow the board level to be approxi- mately midway up the height of this connector. This allows for a low profile while still allowing the con- nector to be rigidly mounted to the board. All of the existing low profile vertical modular jacks are approxi- mately sixteen millimeters high, all of which is on top ofthe board. This design allows for flexibility in height above the board. For our specific applica- tion, we required only ten millimeters above the

board. Integral snaps are 'molded as part of the con- nector housing to provide retention and to strain relief the surface mount solder joints. The connec- tor snaps into a cutout in the printed circuit board from behind. This allows the leads to be surface mount reflow soldered on the back side of the board.

  The unique connector housing allows the...