Browse Prior Art Database

NEW METHOD/TOOL FOR GENERATING ASIC PACKAGE PIN ASSIGNMENTS

IP.com Disclosure Number: IPCOM000007029D
Original Publication Date: 1993-Oct-01
Included in the Prior Art Database: 2002-Feb-19
Document File: 3 page(s) / 163K

Publishing Venue

Motorola

Related People

Michael Stanley: AUTHOR

Abstract

Motorola ASIC offets several families ofmacrocell arrays. Most of these have a predefined set of pack- ages available. The bonding arrangement (die pad to package pin) is pre-assigned at the factory for each array/package combination in the general offering. Input/Output buffers are composed of transistors present in predetined I/O sites. The relationship from a given I/O site to die pad is also predefined. Users assign an I/O signal to a specific package pin by placing the corresponding I/O buffer on the site driving/driven by the bonding pad (bonded out to the package pin in question).

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MOTOROLA INC. Technical Developments Volume20 October 1993

NEW METHOD/TOOL FOR GENERATING ASIC PACKAGE PIN ASSIGNMENTS

by Michael Stanley

  Motorola ASIC offets several families ofmacrocell arrays. Most of these have a predefined set of pack- ages available. The bonding arrangement (die pad to package pin) is pre-assigned at the factory for each array/package combination in the general offering. Input/Output buffers are composed of transistors present in predetined I/O sites. The relationship from a given I/O site to die pad is also predefined. Users assign an I/O signal to a specific package pin by placing the corresponding I/O buffer on the site driving/driven by the bonding pad (bonded out to the package pin in question).

  The tool outlined in this paper implements a new paradigm for assignment of signals to specific package pins: the intelligent datasheet. The tool con- tains the following elements:

1. a two-dimensional table (the pinout table in Figure l), in which each row contains:
a. die pad number
b. I/O site name. Sites which are available for placement of a pad cell have the name im- plemented as a button, These buttons have several modes of operation (see 2. below). A site button is labelled in Figure 1.
c. package pin name
d. signal name field
e. an indicator ofwhether preplaced power (if applicable at that site) is package depen- dent or not.
f. the side of the array that the site/pad are on (top, bottom, let?, right)
g. instance name field, used for placing non- padcell instances on an I/O site. The cur- rent tool allows the user to type the instance name directly into this field. The point and click interface described below may be ex- tended to these fields in the titture.
(a), (b), (c), (e) and(t) above are extracted from Motorola databases when the tool is invoked, The table is generated on-the-fly based on this information.

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2. a cyclic field (the Site Action field) that defines what action the tool takes when the user clicks on a site button. Options are:
a. assign signal (shrinking selection list-sig- nals are removed from the list as they are placed)
b. assign signal (mark assigned signals in list- assigned signals are marked as assigned)
c. assign signal (no update to signal list-the selection list is static)
d. assign power (shrinking)
e. assign power (marked) f assign power (static)
g. assign scan chain (marked)
h. unassign signal

  These options also affect the operation of a list box that is posted when the tool is stated. This list box is labelled "Signal List Box" in Figure 1. Based on the choice of (a) through
(g) above, the list box displays possible choices for: design signal names, power signal names or scan chains. If(h) is chosen, the list box is removed from the display. Clicking on a site button will then clear any signal/power assign- ment currently placed on that site.

Changing the Site Action field to one of
(a) through (g) and clicking any Site button will repost the list box.

  Site button...