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APPARATUS AND METHOD FOR CHANGING A WAFER DICING CHUCK

IP.com Disclosure Number: IPCOM000007070D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2002-Feb-22
Document File: 1 page(s) / 49K

Publishing Venue

Motorola

Related People

Rinjiro Kohno: AUTHOR [+2]

Abstract

Semiconductor wafers are cut into chip size using a wafer dicing machine. The Semiconductor water is placed on a dicing chuck which is otten screwed into a dicing table. A vacuum is placed on the wafer from inside the dicing chuck (originating from the dicing table). With the constant pounding and cut- ting performed on the chuck, maintenance is required and the chuck must be unscrewed from the dicing table.

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MOTOROLA Technical Developments Volume 21 February 1994

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APPARATUS AND METHOD FOR CHANGING A WAFER DICING CHUCK

by Rinjiro Kohno and Hiroyuki Tatsuno

  Semiconductor wafers are cut into chip size using a wafer dicing machine. The Semiconductor water is placed on a dicing chuck which is otten screwed into a dicing table. A vacuum is placed on the wafer from inside the dicing chuck (originating from the dicing table). With the constant pounding and cut- ting performed on the chuck, maintenance is required and the chuck must be unscrewed from the dicing table.

  The above Figure shows a simple disc mechan- ism 10 resting on top of a dicing chuck 12. Disc mechanism 10 comprises a bottom plate 14 which completely covers the mouth of chuck 12, and one or two more discs 16 used for support when apply-

ing a torque to chuck 12. The top disc 18 has a hole which is square or notched to allow a torque or ratchet wrench to be inserted. A vacuum is placed on mechanism 10 and the wrench inserted into the disc's hole. Applying a moment to the disc using the wrench unscrews chuck 12. The mechanism 10 is removed by releasing the vacuum. A wrench is not the only method of applying a moment to mechanism 10, but is used for explanation purposes here and is considered a preferred embodiment.

  This apparatus and method are particularly use- ful because there is very little room between the dicing chuck and the blade apparatus.

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10

0 MOtOrOla, 1°C. 1994

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