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WIRE BOND TOOLING FOR RIGID-SUBSTRATE DUAL-SIDED MCM-L PACKAGES

IP.com Disclosure Number: IPCOM000007114D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2002-Feb-26
Document File: 1 page(s) / 69K

Publishing Venue

Motorola

Related People

Harold Anderson: AUTHOR

Abstract

In front-end packaging assembly of integrated circuits (IQ the process of wire bonding is one method by which electrical interconnects are made between the chip and the package.

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MOlOROLA Technical Developments Volume 21 February1994

WIRE BOND TOOLING FOR RIGID-SUBSTRATE

DUAL-SIDED MCM-L PACKAGES i,

by Harold Anderson

  In front-end packaging assembly of integrated circuits (IQ the process of wire bonding is one method by which electrical interconnects are made between the chip and the package.

  Conventional IC package design utilizes only one side of the substrate. The tooling shown in Figure 1 is typical of that used for a package with active com- ponents on only one side. The tooling consists of a top-side (clamp), and a bottom-side (adaptor) fixture.

  Figure 3 shows a dual-sided MCM-L tooling set developed to allow for processing a package with active components on both sides of the package. The tooling consists of the same two components, a clamp and adaptor, however, there are design differences that allow for processing)a dual-sided unit.

  With rigid substrate MCM-L packages shown in Figure 2, the substrate has a PC-board laminate that makes the substrate rigid enough to allow assem- bly on both sides. When the conventional tooling design shown above is used to process a package with assembly required on both sides, damage to previous assembly occurs afier the package enters

the bonding area of the tooling.

 PCBoard Laminate (!o!J and boiiml Of leaciiram~, -ry ChP9 (41 ASIC chip) /

FIG.3 MCM-L ToolinP

  A cavity area exists in the adaptor to prevent damage to the previous assembly, and heat to the crit- ical areas of the package for fully...