Browse Prior Art Database

PACKAGING NON-SMT COMPONENTS

IP.com Disclosure Number: IPCOM000007125D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2002-Feb-27
Document File: 1 page(s) / 58K

Publishing Venue

Motorola

Related People

Christopher Walvoord: AUTHOR [+3]

Abstract

The JCP Box provides a robust method ofpack- aging non-surface mount components in an other- wise all surface mount package such as a PolyBent" module. The JCP Box provides an effective seal, excellent vibration support, and a relatively simple attachment method for non-smt components such as large torroids and capacitors. The JCP Box also reuses a great deal of connector technology in order to minimize the risks inherent in any new design.

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MOIOROLA Technical Developments Volume 21 February 1994

PACKAGING NON-SMT COMPONENTS

by Christopher Walvoord, Jeff Pflug and Pat McGovern

INTRODUCTION DESIGN ADVANTAGES

  The JCP Box provides a robust method ofpack- aging non-surface mount components in an other- wise all surface mount package such as a PolyBent" module. The JCP Box provides an effective seal, excellent vibration support, and a relatively simple attachment method for non-smt components such as large torroids and capacitors. The JCP Box also reuses a great deal of connector technology in order to minimize the risks inherent in any new design.

  The JCP Box provides the following design advantages over the common technique of individu- ally supporting the odd components.

1) The large components are directly attached to the housing and are well supported in vibration.

  2) The overall module thickness is reduced by placing the tall components outside the main enclosure.

  The JCP Box consists of an outer shell housing and the individual electrical components. The elec- trical components are placed in the housing with their leads sticking out the bottom and they are secured to the housing with either snaps, screws, or an encapsulant. This assembly is then attached to the module in the same manner that the connector is attached, generally with screws from the inside of the module. Once attached, the leads of the compo- nents inside the JCP Box are soldered to the sub- strate using the same process as the...