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Browse Prior Art Database

SPUTTER-DEPOSITION COVER SHIELDS

IP.com Disclosure Number: IPCOM000007131D
Original Publication Date: 1994-Feb-01
Included in the Prior Art Database: 2002-Feb-27
Document File: 2 page(s) / 131K

Publishing Venue

Motorola

Related People

Michael A. Contreras: AUTHOR

Abstract

Currently, most metals are deposited onto sili- con wafers using sputter-deposition equipment. Some sputter deposition equipment has multiple sputtering chambers, such as the Varian 3180'" and 3190" made by Varian Associates of Palo Alto, California. Although the sputtering chamber stations should act relatively independent ofeach other, some metal from a target within one station may "overspray" into an adjacent station during a sputter deposition step. The overspray results in an accumulation of metal within the adjacent, sputtering station. The overspray requires additional cleaning of the oversprayed sputtering station even though it may be unused.

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Technical Developments Volume 21 February 1994

SPUTTER-DEPOSITION COVER SHIELDS

by Michael A. Contreras

  Currently, most metals are deposited onto sili- con wafers using sputter-deposition equipment. Some sputter deposition equipment has multiple sputtering chambers, such as the Varian 3180'" and 3190" made by Varian Associates of Palo Alto, California. Although the sputtering chamber stations should act relatively independent ofeach other, some metal from a target within one station may "overspray" into an adjacent station during a sputter deposition step. The overspray results in an accumulation of metal within the adjacent, sputtering station. The overspray requires additional cleaning of the oversprayed sputtering station even though it may be unused.

  Figure 1 includes a perspective view of a cover shield that can be made to fit over an empty sputtering station. The cover shield may include stain- less steel and is secured by screws as shown in Figure
1. The cover shield may be cleaning similar to other parts of the sputtering chamber stations. Typically, the cover shield is cleaned using at least one acid, such as nitric, hydrochloric, and the like) and

deionized water.

  Figure 2 includes a perspective view of another type of cover shield called a "Contreras" shield. Instead of covering an empty sputtering station, the Contreras shield is used to cover a sputtering sta- tion that includes a Conmag Gun. Other than a few modifications shown in Pigure 2...