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Method for an improved IHS to package adhesion by designing a locking structure for the epoxy sealant material

IP.com Disclosure Number: IPCOM000007138D
Publication Date: 2002-Feb-27
Document File: 3 page(s) / 23K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an improved integrated heat spreader (IHS) to package adhesion by designing a locking structure for the epoxy sealant material. Benefits include improved thermal performance.

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Method for an improved IHS to package adhesion by designing a locking structure for the epoxy sealant material

Disclosed is a method for an improved integrated heat spreader (IHS) to package adhesion by designing a locking structure for the epoxy sealant material. Benefits include improved thermal performance.

Background

              IHS detachment can occur in a conventional large-die application because of poor wetting or adhesion between the IHS and the sealant (see Figure 1). The planar interface enables the crack /delamination to progress without resistance.

              IHS detachment from the epoxy sealant material is a major problem encountered during reliability testing of test vehicles during package development. High bending and shear stresses are due to the mismatch in the coefficient of thermal expansion (CTE) between the copper IHS and the organic package substrate. IHS detachment causes thermal interface material (TIM) delamination and results in degradation of the thermal resistance of the TIM. No conventional solution exists for large die applications. A task force is evaluating process changes to improve the adhesion strength between the IHS and the epoxy sealant material.

Description

      The disclosed method includes a locking structure designed on the IHS edge that is attached to the package substrate with an epoxy sealant material. The locking structure enables increased contact area between the sealant and the IHS. Detachment can only occur if the epoxy sealant tears from the lockin...