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Method for using a blade with an abrasive tip and non-abrasive sides to enable the separation of devices with a CDO on the existing saw equipment

IP.com Disclosure Number: IPCOM000007144D
Publication Date: 2002-Feb-27
Document File: 3 page(s) / 59K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for using a blade with an abrasive tip and non-abrasive sides to enable the separation of devices with weak and brittle materials on the existing saw equipment. Benefits include improved reliability and reduced defects.

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Method for using a blade with an abrasive tip and non-abrasive sides to enable the separation of devices with a CDO on the existing saw equipment

Disclosed is a method for using a blade with an abrasive tip and non-abrasive sides to enable the separation of devices with weak and brittle materials on the existing saw equipment. Benefits include improved reliability and reduced defects.

Background

              The disclosed method addresses the problem of dicing ductile copper interacts with silicon-industry blades that all create a rough edge. It is a source of crack propagation into the device layers and into the device causing fatal defects. These defects are increasing as the device material properties move toward weaker adhesions and become more brittle  to meet other electrical properties.

              While conventional solutions are still in development, the conventional blade has diamonds in the substrate from the hub to the cutting tip (see Figure 1). Lasers are being used to remove device layers prior to dicing. However, the use of lasers adds an additional operation and additional cost to building units.

General description

              The disclosed method  includes a blade designed to have diamonds on its face (tip) but not on its sides. The key elements of the method are:

•             Blade that uses a conventional diamond abrasive to cut material, enabling the cutting edge to remain the same

•             Diamonds that are removed from the edge of the blade that interacts with the device

Advantages

              The technical advantage o...