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NEW DESIGN FOR HOTWALL REACTION CHAMBERS

IP.com Disclosure Number: IPCOM000007212D
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2002-Mar-05
Document File: 2 page(s) / 65K

Publishing Venue

Motorola

Related People

Emmett Howard: AUTHOR [+2]

Abstract

The length of the reaction chamber relative to the heating element is critical to maximize film uni- formity and minimize particulate levels in the reac- tion chamber.

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Technical Developments Volume 22 June 1994

NEW DESIGN FOR HOlWALL REACTION CHAMBERS

by Emmett Howard and Rose Peterman

  The length of the reaction chamber relative to the heating element is critical to maximize film uni- formity and minimize particulate levels in the reac- tion chamber.

  Limiting the reaction chamber length to that of the heating coils in the element can improve within run uniformity and decreases the particulate buildup in all hotwall reaction chambers, most notably in Low Pressure Chemical Vapor Deposition (LPCVD) systems.

  Matching the chamber length to element length greatly reduces the temperature variation along the outermost portion of the reaction chamber. It is in these extreme locations where the most non-

continuous films are deposited. Film composition and stress is such that deposited material peels and flakes off the chamber walls. The cause is insufh- cient temperature to produce the desired reaction.

  Reducing the amount of the reaction chamber exposed to room temperature increases the mini- mum temperature and reduces the total tempera- ture variation in the tube. A more uniform temper- ature leads to better with-in-run film uniformity and homogeneous film deposition throughout the cham- ber. This in turn reduces the stress and free particu- late material which can damage or interfere with the electrical paths ofthe semiconductor devices being fabricated.

D Motarola, 1°C. ,994 77

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