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Method for a multi-prong solder paddle contact design for an electronic socket

IP.com Disclosure Number: IPCOM000007231D
Publication Date: 2002-Mar-06
Document File: 3 page(s) / 3M

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a multi-prong solder paddle contact design for an electronic socket. Benefits include improved reliability and improved performance.

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Method for a multi-prong solder paddle contact design for an electronic socket

Disclosed is a method for a multi-prong solder paddle contact design for an electronic socket. Benefits include improved reliability and improved performance.

Background

              Standard contacts are surface mounted with solder spheres on flat paddle contacts (see Figure 1).

General description

              The disclosed method is a contact for use in an electronic circuit surface mounted socket. The contact is a conventional shape with an additional anchor feature.

              A contact, typically embedded in an electronic processor socket, makes contact with a processor pin and surface mounts to a processor board. The socket surface that contacts the solder sphere has multiple prongs that act as an anchor to hold the solder sphere in place and provide an electrical interface (see Figure 2).

Advantages

              The middle prong of the contact solder-attach surface (paddle) acts as a positioning anchor and strengthening post for the solder sphere. This reinforcement reduces the tendency for solder to wick up the contact. This design also increases the contact area of the solder contact interface.  It is strengthened so that shear and force loads do not cause contact solder separation. The contact can absorb more load, resulting in a more reliable socket.

              The disclosed design does not require significant redesign to work in a standard SMT socket.

Detailed description

              The disclosed method is an electrical contact that is embedded in a circui...