Browse Prior Art Database

Method for a burn-in socket with a heat spreader and spring

IP.com Disclosure Number: IPCOM000007235D
Publication Date: 2002-Mar-06
Document File: 3 page(s) / 27K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a burn-in socket (BIS) with a heat spreader and spring. Benefits include improved thermal performance, reduced defects, and improved product flexibility.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 50% of the total text.

Method for a burn-in socket with a heat spreader and spring

Disclosed is a method for a burn-in socket (BIS) with a heat spreader and spring. Benefits include improved thermal performance, reduced defects, and improved product flexibility.

Background

      The disclosed method addresses the problem of products with no integrated heat spreader (attached to the die) being damaged when contacting the heatsink of the burn-in chamber. These devices contact either bare-metal heatsinks or heatsinks with a liquid metal thermal interface. The devices that contact bare-metal heatsinks have an increased rate of chipping. Future products with bare die will be incompatible with the liquid metal interface material due to interactions between the die and metal. The die is damaged if it makes contact with the liquid metal.

              Two types of conventional solution exist, depending upon the equipment in which the device is tested. The first equipment type has an air interface. A heatsink is integrated into the socket (see Figure 1). It has a pedestal size that is smaller than the die. The pedestal makes contact with the die. Cracking of the die is prevented because the portion of the heatsink coming into contact with the die is within the outline of the die and does not contact the edges and corners.

              The second equipment type has an interface to a heatsink. The problem of bare die products being damaged when interfacing with the burn-in chamber heatsink has no conventional solution. An open-topped socket (no heatsink or heat spreader) enables a direct interface between the device and the bu...