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A Method for Making Single-Sided or Asymmetrical Build-Up IC Package Substrates by Using Dielectric Seal and Sacrificial Injection Molded Plastic Picture Frames

IP.com Disclosure Number: IPCOM000007237D
Publication Date: 2002-Mar-06
Document File: 4 page(s) / 29K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses dielectric films and picture frame plastic to temporarily join core panels of two substrates prior to adding symmetric build-up layers on both sides of the combined core panels. Benefits include minimizing the cost of the substrate by reducing the number of layers.

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A Method for Making Single-Sided or Asymmetrical Build-Up IC Package Substrates by Using Dielectric Seal and Sacrificial Injection Molded Plastic Picture Frames

Disclosed is a method that uses dielectric films and picture frame plastic to temporarily join core panels of two substrates prior to adding symmetric build-up layers on both sides of the combined core panels. Benefits include minimizing the cost of the substrate by reducing the number of layers.

Background

Current industry practice uses a symmetrical build-up process. Due to limitations in the substrate manufacturing process, unnecessary dielectric and metal layers are added to the backside of the IC package substrate. These layers increase the cost of the substrate.

General Description

In the disclosed method, a picture-frame shaped seal (made up of picture frame molded plastic and over-sized dielectric films) is created around the edges of the combined panels. This seal prevents processing chemicals from coming in contact with the combined panels, and keeps the panels joined during the build-up layer process. The seal is laminated over the entire surface of the core, and extends beyond the edges of the core. The combined core is treated as if it is a single standard core. Near the end of the process, the temporary dielectrics are cut out to separate the two panels from each other, then each panel is finished to create the final substrate.

The following steps outline the process flow of the disclosed method:

1.      Pre...