Browse Prior Art Database

Method for a process carrier spring that provides two-point contact on the substrate for greater retention within the carrier pocket

IP.com Disclosure Number: IPCOM000007241D
Publication Date: 2002-Mar-06
Document File: 5 page(s) / 212K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a process carrier spring that provides two-point contact on the substrate for greater retention within the carrier pocket. Benefits include improved performance, improved reliability, and reduced defects.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 50% of the total text.

Method for a process carrier spring that provides two-point contact on the substrate for greater retention within the carrier pocket

Disclosed is a method for a process carrier spring that provides two-point contact on the substrate for greater retention within the carrier pocket. Benefits include improved performance, improved reliability, and reduced defects.

Background

      During the assembly process, the carriers and the substrates within their pockets are exposed to a variety of environmental conditions, including:

•             High temperatures

•             Vibration

•             Direct pressure

•             Suction

      These forces can push the substrates out of the carrier pockets (SOOP). This problem is especially acute with large form factor substrates because they have more surface area for forces to react against. If the substrates become dislodged, a yield loss results because the free substrates are not processed through the remainder of their assembly. Occasionally, displaced substrates can cause equipment jams or damage, resulting in larger excursions. The dual-contact spring counteracts the environmental forces and more securely maintains the substrates within the carrier pockets.

      The conventional substrate retention spring makes use of a single point of contact in the middle of the edge of the substrate (see Figure 1). This method is applied regardless of substrate size.

Description

              The disclosed method utilizes a dual-contact Front of Line (FOL) carrier substrate retention spring (see Figure 2). FOL carriers have pockets in which the substrates are contained...