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Method for the use of an autoclave for improved wafer bonding and increased manufacturing throughput

IP.com Disclosure Number: IPCOM000007312D
Publication Date: 2002-Mar-13
Document File: 3 page(s) / 19K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the use of an autoclave for improved wafer bonding and increased manufacturing throughput. Benefits include improved reliability, reduced defects, and improved throughput.

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Method for the use of an autoclave for improved wafer bonding and increased manufacturing throughput

Disclosed is a method for the use of an autoclave for improved wafer bonding and increased manufacturing throughput. Benefits include improved reliability, reduced defects, and improved throughput.

Background

              An autoclave is a large vessel that safely contains high-pressure gas, often much greater than 100 psi. The semi-liquid can be heated in the vessel allowing even heating and the application of pressure to the wafers to be bonded.

      Conventionally, wafers are bonded one at a time in a chamber with pressure and heat applied through a rigid platen (see Figure 1). Because the bonding process requires pressure and temperature to be applied for approximately 30 minutes, parallel processing is required for satisfactory throughput.

General description

              The disclosed method uses an autoclave to apply pressure and heat in the wafer bonding process on 300-mm wafers (see Figure 2). The key elements of the method include:

•             Uniform pressure–Because Si wafers are extremely flat, using air pressure to apply the           bonding force delivers uniform and conformable pressure across the wafer.

•             Uniform temperature–Heated gas delivers uniform heating across the wafer during                  bonding.

•             High throughput–With an autoclave, large numbers of wafers can be batch processed            when the wafers are aligned.

•             Vacuum bag–The wafers to be bonded must be placed inside a flexible bag that is                 evacuated and then seale...