Browse Prior Art Database

DAMAGE RESISTANT HEAT SINK

IP.com Disclosure Number: IPCOM000007330D
Original Publication Date: 1995-Mar-01
Included in the Prior Art Database: 2002-Mar-15
Document File: 2 page(s) / 86K

Publishing Venue

Motorola

Related People

James Gehrke: AUTHOR [+3]

Abstract

One very effective way to produce high efficiency The new heat sink design obtains greater resist- heat sinks with low weight to heat radiation ratios ante to fin damage without loss in cooling surface is to bond formed aluminum tins to a thick alumi- by bonding an addition cooling surface of material num base plate. These bonded metal heat sink tins similar to the cooling tins to the unsupported edge are quite thin and sensitive to damage. of the heat sink fins. This makes a much more rigid box structure and adds heat sinking surface at the One way to protect the tins would be to add same time. sheet metal sides or a cover plate to protect the fins but these approaches end up reducing the available tin cooling surface area.

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Page 1 of 2

0 M

MOTOROLA Technical Developments Volume 24 March 1995

DAMAGE RESISTANT HEAT SINK

by James Gehrke, Rich Burzynski and Rob Hirsbrunner

BACKGROUND: PRINCIPLE OF OPERATION:

  One very effective way to produce high efficiency The new heat sink design obtains greater resist- heat sinks with low weight to heat radiation ratios ante to fin damage without loss in cooling surface is to bond formed aluminum tins to a thick alumi- by bonding an addition cooling surface of material num base plate. These bonded metal heat sink tins similar to the cooling tins to the unsupported edge are quite thin and sensitive to damage. of the heat sink fins. This makes a much more rigid box structure and adds heat sinking surface at the One way to protect the tins would be to add same time.
sheet metal sides or a cover plate to protect the fins
but these approaches end up reducing the available
tin cooling surface area.

Prior Art

Side Support

Prior Art

16 0 Motorola. 1°C. ,995

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Page 2 of 2

MO7VROLA Technical Developments Volume 24 March 1995

Note - Fin height goes down by support plate thickness but fin area is increased by connecting surface (l/2 area of support plate) Bonded Support Plate

New Approach

0 Motorola. Inc. ,995 17

[This page contains 15 pictures or other non-text objects]