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Method for producing a heat pipe enhanced thin-fin mushroom heatsink

IP.com Disclosure Number: IPCOM000007554D
Publication Date: 2002-Apr-04
Document File: 3 page(s) / 83K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for producing a heat pipe enhanced thin-fin mushroom heatsink. Benefits include improved thermal performance.

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Method for producing a heat pipe enhanced thin-fin mushroom heatsink

Disclosed is a method for producing a heat pipe enhanced thin-fin mushroom heatsink. Benefits include improved thermal performance.

Description

              The disclosed method consists of a thin-fin mushroom heatsink designed to incorporate cylindrical heat pipes. The mushroom heatsink concept maximizes the available heat transfer area in the region surrounding the processor by extending up and over the adjacent components (see Figure 1). However, in cases where a mushroom heatsink has thin fins, the effectiveness of the outer fins is reduced due to the distance that energy must be transported through the thin fin material from the base to the overhanging fins.

              By incorporating heat pipes into the mushroom heatsink concept, the effectiveness of these overhanging fins can be greatly improved by transporting energy directly from the base to the overhanging fins through the heat pipes. Because heat pipes have an extremely low effective thermal conductivity, energy may be efficiently transported from the base to the fins with a relatively low temperature drop. The dual or triple heat pipes are embedded into the base and are mechanically attached to the fins. The overhand regions may be asymmetric (see Figures 2 and 3) or symmetric (see Figures 4 and 5).

              The disclosed method works by creating various energy transport paths in a heatsink to maximize fin effectiveness and minimize overall heatsink thermal resistance. Energy from the processor ente...