Browse Prior Art Database

FLEXIBLE PHOTONICS CARRIER ELECTRICAL ATTACH SUBSTRATE

IP.com Disclosure Number: IPCOM000007565D
Original Publication Date: 1995-Nov-01
Included in the Prior Art Database: 2002-Apr-05
Document File: 2 page(s) / 101K

Publishing Venue

Motorola

Related People

Brant Besser: AUTHOR

Abstract

The design of fiber optics transmit and receive hardware requires that the fiber optics cable have direct access to the solid state devices that convert between light and electrical impulses (Photonics devices). To accomplish this task it is necessary to maintain the critical alignment of the fiber optics connector and the junctions ofthe photonics devices during mating and de-mating. The tight mechani- cal tolerances required to maintain this alignment can result in a great deal of stress on the assembly which holds the photonics devices. At the same time, the high frequency of the electrical signals used to power and detect the photonics devices require extremely low capacitance, inductance and cross talk in the electrical interconnect circuitry. The Flexible Photonics Carrier Electrical Attach Substrate described below accomplishes both mechanical and electrical integrity ofthe module.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 50% of the total text.

Page 1 of 2

0 M

MolylRoLA !' Technical Developments

FLEXIBLE PHOTONICS CARRIER ELECTRICAL ATTACH SUBSTRATE

by Brant Besser

  The design of fiber optics transmit and receive hardware requires that the fiber optics cable have direct access to the solid state devices that convert between light and electrical impulses (Photonics devices). To accomplish this task it is necessary to maintain the critical alignment of the fiber optics connector and the junctions ofthe photonics devices during mating and de-mating. The tight mechani- cal tolerances required to maintain this alignment can result in a great deal of stress on the assembly which holds the photonics devices. At the same time, the high frequency of the electrical signals used to power and detect the photonics devices require extremely low capacitance, inductance and cross talk in the electrical interconnect circuitry. The Flexible Photonics Carrier Electrical Attach Substrate described below accomplishes both mechanical and electrical integrity ofthe module.

  A flexible Kapton substrate approximately ,004" thick with Copper tracks for electrical conduction will be fabricated. This fabrication is similar to that used for tape in Tape Automated Bonding (TAB). The Copper tracks are Nickel and Gold plated in order to aid in the attachment of the wire bonds connecting the photonics device to the Kapton sub- strate. This Kapton substrate will act as the entire metal routing system from the photonics device to the MCM. This Kapton substrate is bonded to a

metal carrier (probably Aluminum) which is also to be used to mount the Photonics device. The metal carrier function is three-fold, it acts at the mechani- cal connection for the photonic...