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Method for a heat transfer surface design

IP.com Disclosure Number: IPCOM000007588D
Publication Date: 2002-Apr-08
Document File: 2 page(s) / 111K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a heat transfer surface design. Benefits include improved thermal performance and improved reliability.

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Method for a heat transfer surface design

Disclosed is a method for a heat transfer surface design. Benefits include improved thermal performance and improved reliability.

Description

              The disclosed method is a heat transfer surface design, which increases the heat transfer between two objects, such as an integrated heat spreader (IHS) and a heatsink. One implementation of the disclosed method is an IHS with the heat transfer surface design that interfaces with a heatsink with the same (mirror image) heat transfer surface design (see Figures 1 and 2). However, various other geometries, angles, profiles, and dimensions can be utilized. The scale of the heat transfer surface design is ~1.0 mm in height and ~0.5 mm in width. The heat transfer surface design improves the heat transfer between the two objects because the contact area of the surfaces is substantially greater.

              The disclosed method  (a heat transfer surface design) is a simple, cost-effective method to improve the heat transfer between objects. Various processes can be used to create the heat transfer surface design, including:

§         Forging

§         Extruding

§         Stamping

§         Machining

§         Cutting

§         Grinding

§         Casting

Advantages

              The contact area between objects is increased compared to conventional designs (simple flat surfaces), enabling a greater heat transfer (2X or greater increase in surface area).

              A second thermal interface material (TIM) may be eliminated (bare metal contact only).

              If a thermal interface material is needed, th...