Browse Prior Art Database

Method for solder ball stand-off management to enable ball-side package decoupling on BGA packages

IP.com Disclosure Number: IPCOM000007589D
Publication Date: 2002-Apr-08
Document File: 2 page(s) / 16K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for solder ball stand-off management to enable ball-side package decoupling on BGA packages. Benefits include improved thermal performance and reduced manufacturing processing.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 77% of the total text.

Method for solder ball stand-off management to enable ball-side package decoupling on BGA packages

Disclosed is a method for solder ball stand-off management to enable ball-side package decoupling on BGA packages. Benefits include improved thermal performance and reduced manufacturing processing.

Background

              Conventionally, a hole is routed in a motherboard to enable BGA-package land-side caps to protrude through the board.

Description

              The disclosed method includes a choice of solder ball and capacitor materials to enable land-side processing on surface-mount BGA packages (see Figure 1). The key elements of the method are:

§         High stand-off BGA solder balls

§         Low-profile package capacitors

Advantages

              The disclosed method provides advantages over the conventional solution, including:

§         An elegant approach to cost-effective power delivery to the package (lower layer count package)

§         No additional cost/manufacturing overhead for OEMs

§         Synergy between socketed and surface mounted processors (DV management)

Detailed description

              The disclosed method utilizes 30-mil diameter 10/90 Sn/Pb, Sn/Ag or Sn/Ag/Cu solder balls. This design provides reliable joints on a 50-mil ball grid package. The reflow profiles must be configured so the solder ball is not reflowed. The joint is formed by the solder paste. This design provides a stand off of at least 0.75 mm on the landside. This dimension enables the placement of low-profile caps that are 0.55 mm in height on the BGA side of the package.

...