Browse Prior Art Database

BUILDING AND TESTING A HI-SPEED MODULE/IC PACKAGE

IP.com Disclosure Number: IPCOM000007607D
Original Publication Date: 1996-May-01
Included in the Prior Art Database: 2002-Apr-09
Document File: 3 page(s) / 113K

Publishing Venue

Motorola

Related People

Bob Scofield: AUTHOR

Abstract

The electrical test ofmultiple semiconductor die modules or packages have to address the problem of having the inputs and outputs of complex semicon- ductor die unavailable for the application oftest stim- ulus and measurement. The test and evaluation of the product generally requires the generation of a long and arduous set of test vectors for system level test, In most cases, total fault coverage with respect to the operating frequency range and application spec- trum of the product must be sacrificed such that only fault coverage for an application-specific set of operating conditions can be guaranteed.

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Technical Developments

BUILDING AND TESTING A HI-SPEED MODULE/IC PACKAGE

by Sob Scofield

  The electrical test ofmultiple semiconductor die modules or packages have to address the problem of having the inputs and outputs of complex semicon- ductor die unavailable for the application oftest stim- ulus and measurement. The test and evaluation of the product generally requires the generation of a long and arduous set of test vectors for system level test, In most cases, total fault coverage with respect to the operating frequency range and application spec- trum of the product must be sacrificed such that only fault coverage for an application-specific set of operating conditions can be guaranteed.

  The multi-die package or module would be built in several parts (see Figure 1). Each part is designed to interface with its related section or sections to form a complete module or package. The electrical interconnects between the sections can be designed to use existing processing methods and to maintain an extremely wide electrical bandwidth well into the microwave region depending upon the electrical char- acteristics of the materials used in the respective layers ofthe package. By using two or more sections to form the module or package, one may change any section without destroying the utility of adja- cent sections. For example the pin-out or contact section could be designed to be PGA, LGA, BGA, QFP etc., without modifying the rest of the assem- blies. Interconnect density and configurations can

be changed with minimal cost.

  A sectional design would be used to Molly test and characterize the respective sections ofthe multi- die package or module. The Die Attach Section (Fig- ure 1 & 2A) is designed so that there are no unterminated stubs, which cause bandwidt...