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MODULAR POWER SUBSTRATE DESIGN CONCEPT FOR MULTIPLE HIGH POWER MODULE APPLICATIONS

IP.com Disclosure Number: IPCOM000007610D
Original Publication Date: 1996-May-01
Included in the Prior Art Database: 2002-Apr-09
Document File: 3 page(s) / 114K

Publishing Venue

Motorola

Related People

Joe Martinez: AUTHOR [+3]

Abstract

In summary, this idea covers the design and method of making a high-power module. A high- power module structure is proposed composed of the following: silicon or gallium arsenide chips, alu- minum or gold wirebonds, a metallized ceramic sub- strate, metal buss-bars, and a heatsink. All compo- nents are encased in plastic, filled with a silicon gel and an epoxy for protection.

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0 M M-ROLA

Technical Developments

MODULAR POWER SUBSTRATE DESIGN CONCEPT FOR MULTIPLE HIGH POWER MODULE APPLICATIONS

by Joe Martinez, Ken Berringer and Carl Raleigh

  In summary, this idea covers the design and method of making a high-power module. A high- power module structure is proposed composed of the following: silicon or gallium arsenide chips, alu- minum or gold wirebonds, a metallized ceramic sub- strate, metal buss-bars, and a heatsink. All compo- nents are encased in plastic, filled with a silicon gel and an epoxy for protection.

The idea is to use a single, one-piece ceramic substrate with silicon chips ofdifferent transistor types
(i.e. IGBT and diode) mounted onto the one-piece ceramic substrate and arrange this one-piece ceramic substrate in an array on a heatsink with other simi- lar one-piece ceramic substrates and electrically con- nect the one-piece ceramic substrates by an electri- cally conductive buss-bar to produce one electrical circuit (i.e. a single switch IGBT in parallel with a diode). The same one-piece ceramic substrate can be arranged in a similiar array, however, using a different bussing structure, can produce a second elec- trical circuit (i.e. a half-bridge IGBT with diode in

parallel switch). Thirdly, the same one-piece ceramic substrate can be arranged in a similiar array, and again using a different bussing structure, produce a third electrical circuit (an IGBT/diode six-pack or three-phase output inverter). All three arrays and elec...