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Method for a balanced load surface-mount, shielded, flexible contact for an electronic socket

IP.com Disclosure Number: IPCOM000007616D
Publication Date: 2002-Apr-09
Document File: 5 page(s) / 45K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a balanced load surface-mount, shielded, flexible contact for an electronic socket. Benefits include improved reliability and improved performance.

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Method for a balanced load surface-mount, shielded, flexible contact for an electronic socket

Disclosed is a method for a balanced load surface-mount, shielded, flexible contact for an electronic socket. Benefits include improved reliability and improved performance.

Background

               With an electronic circuit surface-mounted socket, stress concentrates at the solder sphere (see Figure 1) because of one-sided loading of the contact load (see Figure 2). As a result, sockets fail at the solder paddle/solder sphere interface under load. This problem is conventionally solved by changing a combination of the solder paddle size, housing interaction with the solder sphere, plating, and contact flexibility. The processor board may be reinforced to reduce the deflection and the solder sphere load on the contact within the socket.

Description

              The disclosed method includes a contact support feature for use in an electronic circuit surface-mounted socket (see Figure 3). The contact is flexible and shielded.

              The plastic or LCP socket-housing feature supports the contact to minimize the load on the contact. The contact has a flexible wire-like body and solid top and base. The contact is typically embedded in an electronic processor socket that makes contact with a pin from a processor and surface mounts to a processor board. The surface that contacts the solder material, paste or solder sphere is not pressed down significantly when the contact is loaded. The initial flex, caused by loading the socket with a pinned circuit, pushes the contact top down against the base of the housing.  The contact body flexes to virtually eliminate the load seen by the solder ball and paddle.  The load is equalized throughout the housing, eliminating stress concentrations at the solder sphere.

              The top of the contact touches the pin from a pinned circuit (see Figure 4). The body is a straight section that connects the pin contact area to the solder paddle at the bottom of the contact. The body is an inductance area. The inductance can be limit...