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DISPOSABLE/INTERCHANGEABLE VACUUM TABLE SURFACE FOR THE APPLICATION AND REMOVAL OF ADHESIVE MATERIALS

IP.com Disclosure Number: IPCOM000007681D
Original Publication Date: 1996-May-01
Included in the Prior Art Database: 2002-Apr-15
Document File: 2 page(s) / 96K

Publishing Venue

Motorola

Related People

Robert Clark: AUTHOR [+3]

Abstract

Most wafer thinning operations protect the front side (circuit side) of their wafers with a protective laminate. The laminate is placed on the front side of the wafer to protect the circuitry while the wafer is mechanically thinned. Once the wafer has been thinned, the laminate must be removed.

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MO7VROLA Technical Developments

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DISPOSABLE/INTERCHANGEABLE VACUUM TABLE SURFACE FOR THE APPLICATION AND REMOVAL OF ADHESIVE MATERIALS

by Robert Clark, Anthony Weeks and Rex lckes

  Most wafer thinning operations protect the front side (circuit side) of their wafers with a protective laminate. The laminate is placed on the front side of the wafer to protect the circuitry while the wafer is mechanically thinned. Once the wafer has been thinned, the laminate must be removed.

  The delamination process consists ofpositioning a wafer on a table with a vacuum chuck, rolling the delamination tape across the top (laminated side) of the wafer, and then peeling back the delamination tape. By peeling back the delamination tape, the protective laminate is removed from the wafer. Unfortunately, there are no standard lamination or delamination tapes.

  Wafer breakage's occur when one of the filament fibers breaks from the delamination tape and sticks to the delamination tables surface. As the delami- nation tape is rolled across the wafer, the unbroken portion of the delamination tape removes the pro-

tective laminate. The broken filament portion ofthe delamination tape, or "stringer:' does not assist in the removal of the protective laminate, but rather, has the ability to tape the wafer to the delamina- tion tables surface.

  This invention modifies the existing delamina- tion tables surface by: eliminating all adhesive to metal contact, provides interchangeable delamina- tion table surfaces which may reduce the surface area to which the adhesive contacts the delamina- tion table, and finally, this invention allows the pro- cess engineer to discard used or damaged delamina- tion table surfaces.

  The elimination of all adhesive to metal contact was achieved by implementing Teflon inserts at the front and re...