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Method for a socket with enhanced power delivery

IP.com Disclosure Number: IPCOM000007715D
Publication Date: 2002-Apr-16
Document File: 3 page(s) / 68K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a socket with enhanced power delivery. Benefits include improved power performance.

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Method for a socket with enhanced power delivery

Disclosed is a method for a socket with enhanced power delivery. Benefits include improved power performance.

Background

              Supplying the required electric current for server and high-end desktop CPUs at a low cost presents a challenge. Conventionally, separate power pods are used to supply large amounts of power to server CPUs. This is a relatively expensive solution. For high-end desktops, power delivery is not an issue. However, it is expected to become a major issue in the near future. Using separate power pods may not be an option because of the cost limitations.

              The obvious solution to increasing the power to a package is to increase the number of pins. However, increasing the number of pins translates to increased socket and package size and introduces cost and reliability issues. Low-cost motherboards may not be able to supply this large power cheaply.

              Conventionally, socketing is done by inserting the package pins in the socket and then engaging the locking mechanism. The locking mechanism is typically a cam-activated lever that moves the top cover of the socket along with the package to lock the package. This mechanism is complex and expensive. Increasing pin count typically increases the engagement force leading to an increase in the size of the links and levers in the socket and, therefore, its size, cost and complexity.

              Conventional retention mechanisms that are mounted to the motherboard are used to support the heatsinks.

Description

              The disclosed method is a technique to provide adequate power to a package using a single socket without havin...