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Method for a mirrored stacked-die package

IP.com Disclosure Number: IPCOM000007718D
Publication Date: 2002-Apr-16
Document File: 1 page(s) / 142K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a mirrored stacked-die package. Benefits include improved functionality and improved performance.

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Method for a mirrored stacked-die package

Disclosed is a method for a mirrored stacked-die package. Benefits include improved functionality and improved performance.

Description

              The disclosed method is a grooved substrate (see Figure 1). Each die is stacked one after the other. The top three die are like the mirror image of the bottom three die. Total package height could approximate 1.4 mm for a 6-die stack-up. The increase in total memory capacity of the package is achieved with minimal increase in package height. The assembly process and material set are similar for any number of dies included in a package.

Advantages

              The disclosed method provides advantages, including:

§         An option in package thickness reduction

§         Flexibility of stacking additional die without the additional cost incurred with the development/implementation of an assembly process

Fig. 1

Disclosed anonymously