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Browse Prior Art Database

APPARATUS FOR SECURING WAFERS DURING THE GOLD EVAPORATION PROCESS

IP.com Disclosure Number: IPCOM000007756D
Original Publication Date: 1996-Aug-01
Included in the Prior Art Database: 2002-Apr-19
Document File: 2 page(s) / 98K

Publishing Venue

Motorola

Related People

Anthony Robert Weeks: AUTHOR

Abstract

In order to eliminate thin (5 mils) wafer break- age due to shock forces and process vibration, this invention is based on the idea offloating wafers above the inner surrface of the domed holding fixture as opposed to clamping the wafers against its surface. This invention has the ability to absorb shock (caused by dropping the planets onto a flat surface) and proc- ess vibration (induced by planet rotations in the vac- uum chamber) by positioning each water within a protective shield assembly which is supported by a network of springs.

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Technical Developments

APPARATUS FOR SECURING WAFERS DURING THE GOLD EVAPORATION PROCESS

by Anthony Robert Weeks

  In order to eliminate thin (5 mils) wafer break- age due to shock forces and process vibration, this invention is based on the idea offloating wafers above the inner surrface of the domed holding fixture as opposed to clamping the wafers against its surface. This invention has the ability to absorb shock (caused by dropping the planets onto a flat surface) and proc- ess vibration (induced by planet rotations in the vac- uum chamber) by positioning each water within a protective shield assembly which is supported by a network of springs.

  The protective shield is larger than the maxi- mum wafer diameter (3.02") and is counter bored so that the center portion of the shield is thinner than its outer edge (Figure 1). The counter bore is neces- sary for water processing due to the fact that when wafers are placed on the shield, they are positioned circuit side down. The counter bore eliminates most of the shield to circuitry contact which may damage the circuit (most devices have 4KA of passivation to assist in the elimination ofshield to circuitry contact).

to the shield and then silver soldered to the inner side of a standard planetarium. The springs closest to the perimeter of the planetarium are used to form the water clamp. The top of the wafer clamp springs protrude above the shields surface and are attached to a half-moon clamp (Figure 2). To actuate the spring clamp, a tab has been silver soldered between the clamp springs. This was positioned to allow the shield to be pulled away from the half-moon clamp when loading wafers onto the shield. Lastly, two guide rails were silver soldered beyond the clamp springs to assist in loading the wafer into the half- moon clamp and prevent the wafer from resting against any moving parts. The floating shield con- figuration is replicated for each wa...