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Method for a snap-together casing for CPU packaging with an integrated heat spreader

IP.com Disclosure Number: IPCOM000007807D
Publication Date: 2002-Apr-24
Document File: 4 page(s) / 127K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a snap-together casing for CPU packaging with an integrated heat spreader (IHS). Benefits include improved manufacturability and improved reliability.

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Method for a snap-together casing for CPU packaging with an integrated heat spreader

Disclosed is a method for a snap-together casing for CPU packaging with an integrated heat spreader (IHS). Benefits include improved manufacturability and improved reliability.

Background

              Securing the substrate and the heat spreader together permanently with constant compressive force between the die and the spreader is problematic.

              The conventional process uses epoxy to bond the IHS and the substrate together. This process involves a significant number of steps and indirect materials (IDMs) to mount the substrate (die) and heatsink.

              During the IHS attachment process, epoxy is applied between the lid and the package. The IHS bridge clip (see Figure 1) clamps the package between itself and the process carrier (see Figure 2). The assembly proceeds through a cure oven. Following the cure process, the clip is removed from the carrier, and the spreader is bonded to the substrate.

General description

              The disclosed method utilizes a metal casing that contains and clamps a substrate and heatsink (lid) together. The casing is a single-piece device that incorporates alignment features for both substrate and lid. The clamp applies a constant force between the substrate and the heatsink and remains as an integral component of the package in the retail design.

              The method permits a simplification of the assembly process of the semiconductor package when attaching the heatsink to the substrate. A number of direct and indirect materials are eliminated from the current process, including the IHS bridge clip, sealant epoxy, and process carriers made to contain IHS bridge clips.

              The key elements of the method include:

§         Single-piece casing

§         Mechanical features for aligning lid and substrate components

§         Latching features to secure the substra...