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Method for a heatsink clip design with adjustable attaching forces and self-aligned load

IP.com Disclosure Number: IPCOM000007809D
Publication Date: 2002-Apr-24
Document File: 5 page(s) / 78K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a heatsink clip design with adjustable attaching forces and self-aligned load. Benefits include improved functionality and improved reliability.

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Method for a heatsink clip design with adjustable attaching forces and self-aligned load

Disclosed is a method for a heatsink clip design with adjustable attaching forces and self-aligned load. Benefits include improved functionality and improved reliability.

Background

              Conventionally, a clip is used to attach a heatsink to the microelectronic device. Sufficient clip force is required to reduce the thermal-interface layer thickness to achieve a lower thermal resistance. A clip design with an appropriate attachment force is critical.

              The conventional solution utilizes the deformation of the clip to exert the force to attach the heatsink (see Figure 1). The clip is designed with an appropriate deformation after the heatsink is attached to the microelectronic device to control the clip force. However, the conventional heatsink clip design only provides a constant force that is insufficient for the complicated heatsink attach processes that require variable attachment forces.

General description

              The disclosed method is a heatsink clip design with an adjustable screw for varying the attachment force without redesign of the clip. Applying tie-lock to the adjustable screw secures a constant clip force.

              The method can be applied to a situation where a high clip force is required only for the first-time power-up of the microelectronic device to melt down the phase-change interface. Later, the retention force is lowered to avoid damage to the solder joint.

              The method can provide a single-point load on the heatsink base center so that the heatsink is well aligned to the microelectronic device without tilting.

              The key element of the method is a heatsink clip with a screw hole at the clip’s center. The clip can be a single clip, an X-shaped clip, or a +-shaped clip. A screw with a round head is required to apply a single-point loading right on the heatsink base center to reach the best alignment of the heatsink on the microelectronic device.

              A dimple may also be required on the heatsink base so that the heatsink is better secured by the adjustable screw.

 


Advantages

              The disclosed method provides advantages, including:

§         Variable heatsink attachment force by screw adjustment withou...