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Method for an optimized 10-GHz differential signaling package layout for a JCI (thin) substrate flip-chip package with FR-4 board stackup

IP.com Disclosure Number: IPCOM000007825D
Publication Date: 2002-Apr-25
Document File: 3 page(s) / 7M

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an optimized 10-GHz differential signaling package layout for a joint communications instruction (JCI, thin) flip-chip ball grid array (FCBGA) package with FR-4 board stackup. Benefits include improved performance and improved reliability.

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Method for an optimized 10-GHz differential signaling package layout for a JCI (thin) substrate flip-chip package with FR-4 board stackup

Disclosed is a method for an optimized 10-GHz differential signaling package layout for a joint communications instruction (JCI, thin) flip-chip ball grid array (FCBGA) package with FR-4 board stackup. Benefits include improved performance and improved reliability.

Description

              The disclosed method includes an optimized 10-GHz differential package structure for a JCI FCBGA with bump. The method includes the differential co-planar waveguide (CPW) line structure with 50-ohm common characteristic impedance and 100-ohm differential characteristic impedance respectively based on a JCI FCBGA substrate with FR-4 board stackup (see Figures 1 and 2).

              The disclosed package structure enables transmission/reception of up to a 10-GHz digital signal with low crosstalk and small jitter, which meets the industry’s high-speed signal transmission specifications (see Figures 3). The FR-4 stack up is used in 10-GHz transceiver Ethernet applications (see Figure 4).

Advantages

              The disclosed method provides advantages, including:

§         The proposed channel is split from the other part of the whole IC package structure through all layers in the stack up for transmitting high-speed digital signal.

§         The optimized 10-GHz CPW 100-ohm differential signal package layout for JCI substrate FCBGA package with board effect (FR-4 stackup) is used for 10-GHz transceiver Ethernet...