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Method for an optimized 10-GHz differential signaling package layout for a typical 4-layer PBGA package with FR-4 board stackup

IP.com Disclosure Number: IPCOM000007826D
Publication Date: 2002-Apr-25
Document File: 4 page(s) / 3M

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an optimized 10-GHz differential signaling package layout for a typical 4-layer plastic ball grid array (PBGA) package with FR-4 board stackup. Benefits include improved performance and improved reliability.

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Method for an optimized 10-GHz differential signaling package layout for a typical 4-layer PBGA package with FR-4 board stackup

Disclosed is a method for an optimized 10-GHz differential signaling package layout for a typical 4-layer plastic ball grid array (PBGA) package with FR-4 board stackup. Benefits include improved performance and improved reliability.

Description

              The disclosed method includes an optimized 10-GHz differential package structure for a 4-layer PBGA with wirebond. The method includes the differential co-planar waveguide (CPW) line structure with 50-ohm common characteristic impedance and 100-ohm differential characteristic impedance respectively based on a 4-layer PBGA substrate with FR-4 board stackup (see Figures 1 and 2).

              The disclosed package structure enables transmission/reception of an up to 10-GHz digital signal with low crosstalk and low jitter, which meets the industry’s high-speed signal transmission specifications (see Figure 3). Trace width is 70 µm, and separation is 116 µm (see Figure 4). The FR-4 stack up is used in 10-GHz transceiver Ethernet applications (see Figure 5).

Advantages

              The disclosed method provides several advantages, including:

§         The nearest ground plane is used to minimize the CPW trace width for high-speed channels, transmission/receiving, and clock traces. (The other structure has only one channel, transmission or reception.)

§         The optimized 10-GHz CPW differential signal package structure (see Figure 6) including the boa...