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SEALED CONNECTOR ASSEMBLY FOR LOW-COST, HIGH THERMAL CONDUCTIVITY PACKAGE

IP.com Disclosure Number: IPCOM000007922D
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2002-May-06
Document File: 2 page(s) / 96K

Publishing Venue

Motorola

Related People

Peter Collier: AUTHOR

Abstract

There are reported proposals to develop low tem- perature inorganic (glass/ceramic) coating on alu- minum substrates through so-gel or plasma processes and further to form conductor patterns on planar surfaces. The concepts allow for the use of alumi- num as a low-cost, thermally conductive substrate material, but do not address the formation of her- metic, electrical feed-throughs to allow exterior mounting ofa connector.

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Technical Developments

SEALED CONNECTOR ASSEMBLY FOR LOW-COST, HIGH THERMAL CONDUCTIVITY PACKAGE

by Peter Collier

  There are reported proposals to develop low tem- perature inorganic (glass/ceramic) coating on alu- minum substrates through so-gel or plasma processes and further to form conductor patterns on planar surfaces. The concepts allow for the use of alumi- num as a low-cost, thermally conductive substrate material, but do not address the formation of her- metic, electrical feed-throughs to allow exterior mounting ofa connector.

  According to the present idea, Hermetic, elec- trical through-connections are formed in metal (Kovar) packages by the use of glass to metal seals. This approach is not generally applicable to alumi- num substrates because of the expansion mismatch between the metal and glass and because ofthe reflow temperatures required.

  Thick film inks are applied to make electrical connections through (dielectric) substrates in elec- tronic packages produced from ceramic materials.

Metal substrates need first to be insulated, but because of the high tiring temperatures and expan- sion mismatch between inks containing glass hits, this interconnection technique is not currently used with aluminum substrates. To achieve endurance under thermal cycling conditions there needs to be adequate compatibility between the substrate and material used to hrlfil the "through" hole connec- tion. Performance can be influenced by the shape of substrate apertures...