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AN INEXPENSIVE PASSIVE METHOD OF ALIGNING FIBERS TO LASER OR PHOTODETECTOR ARRAYS

IP.com Disclosure Number: IPCOM000007930D
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2002-May-07
Document File: 4 page(s) / 150K

Publishing Venue

Motorola

Related People

Christopher K. Y. Chun: AUTHOR [+3]

Abstract

Inexpensive passive alignment of photonic devices gave simple packaging and good thermal heat sink- to optical fibers will significantly reduce the cost of ing, but would not allow for multiple laser or optical interconnect modules. Historically, single photodetector arrays to be packaged and simply lasers or photodetectors have been packaged onto aligned to fiber ribbons.

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Page 1 of 4

MOZlOROLA Technical Developments

AN INEXPENSIVE PASSIVE METHOD OF ALIGNING FIBERS TO LASER OR PHOTODErECTOR ARRAYS

by Christopher K. Y. Chun, PCRL, Barbara Foley, PCRL, James Knapp, APDAC

  Inexpensive passive alignment of photonic devices gave simple packaging and good thermal heat sink- to optical fibers will significantly reduce the cost of ing, but would not allow for multiple laser or optical interconnect modules. Historically, single photodetector arrays to be packaged and simply lasers or photodetectors have been packaged onto aligned to fiber ribbons.

TO headers as shown in Figure 1. This approach

Fig. 1 Laser Mounted onto a TO header.

  Single lasers or photodetectors packaged in TO packages were actively aligned to single mode fibers for best coupling efficiencies in telecommunication applications. However, active alignment is very time consuming and expensive. With the strong interest in shorter distance optical data transmission systems, multimode fibers have increased in popularity due to their larger core size (.5Opm or 62&m being the most common core diameters) as compared to sin-

gle mode fibers (S-8pm diameters). For multimode fiber applications, the alignment tolerances between the photonic devices and the fiber are easily met with current mold technology The package presented in this paper provides a means of packaging optoelectronic devices or arrays and passively align- ing the device or array to a multimode fiber or an array of multimode optical fibers. Figure 2 shows a conceptual drawing of the packaging technology.

0 Maorma, l"S. 19% I52 November1996

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Page 2 of 4

M-LA Technical Developments

@

LOCKING FEATURE

/ II

MOLDED PACKAGE

LEAD FRAM

OR TAB TAPE

Side View

PIN HOLE

SUPORT PADS

Top View

Fig. 2 Conceptual idea ofa passively aligned optoelectronic package for single device and array applications

0 Motorola, 1°C. 1996 I53 November1996

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Page 3 of 4

MOlVWLA Technical Developments

  The optoelectronic device array which is mounted onto a TAB tape or lead frame can be overmolded into a plastic package with tight alignment toler- ances. The manufacturing steps include 1. designing the TAB tape or lead frame to pr...