Browse Prior Art Database

APPARATUS FOR PROTECTING WAFER PLACEMENT VACUUM CHUCKS

IP.com Disclosure Number: IPCOM000007934D
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2002-May-07
Document File: 2 page(s) / 96K

Publishing Venue

Motorola

Related People

Anthony Robert Weeks: AUTHOR

Abstract

The SEZ Spin Etch process has the ability to leave stains, on the backside of a wafer, which are not visible until gold has been alloyed onto the stained surface (Figure 1). If a wafer breaks, fiat- tures, or is miss-processed, and the SEZ transfer arm touches a stained wafer or a contaminated etch chuck (Figure 2), the vacuum chuck of the transfer arm will be contaminated.

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Technical Developments

APPARATUS FOR PROTECTING WAFER PLACEMENT VACUUM CHUCKS

by Anthony Robert Weeks

  The SEZ Spin Etch process has the ability to leave stains, on the backside of a wafer, which are not visible until gold has been alloyed onto the stained surface (Figure 1). If a wafer breaks, fiat- tures, or is miss-processed, and the SEZ transfer arm touches a stained wafer or a contaminated etch chuck (Figure 2), the vacuum chuck of the transfer arm will be contaminated.

Fig. 1

  The invention presented here eliminates the cross contamination of sequential wafers with the use of a vacuum chuck "condom? To protect the vacuum chuck surface of a transfer arm, a Teflon insert is snapped onto the surface of the existing vacuum chuck (Figure 3). The surface of the "condom" is designed to replicate the surface of a standard vac- uum chuck (Figure 4) therefore, the "condom" has the ability to remove wafers from the etch chuck in the same fashion as the original transfer arm chuck. Furthermore, if the vacuum chuck "condom" tou- ches a contaminated surface (wafer or etch chuck), the "condom" may be removed and either soaked or thrown away.

Fig. 2

  The snap-on vacuum chuck "condom" was designed from Teflon, the same material used to cre- ate the original chuck. The grooves of a vacuum chuck "condom" evenly disperse the vacuum force to allow for gentle handling of thin (5 mil thick) walers. The vacuum chuck "condom" is applied to the transfer arm vacuum chuck by simply pressing the shah of the "condom" into the main vacuum port of a vacuum chuck. The "condom" is pressed into place so that its bottom surface is flush with the top surface of the transfer arm vacuum chuck. Once the "condom" is in place the SEZ Etch Tool functions as if nothing has changed. The vacuum chuck "con...