Browse Prior Art Database

CHAMELEON ASSEMBLY AND TEST CARRIER

IP.com Disclosure Number: IPCOM000007939D
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2002-May-07
Document File: 1 page(s) / 63K

Publishing Venue

Motorola

Related People

Brian A. Webb: AUTHOR [+2]

Abstract

The carrier described herein is suited to handle a leaded, optical, surface mounted package. Many assembly process steps are required before attaching the die and prior to final electrical/optical testing of this package. Because of these process steps, han- dling damage to the package is high. Defects such as scratches of the light guides, bent leads and delam- ination can occur.

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Technical Developments

CHAMELEON ASSEMBLY AND TEST CARRIER

by Brian A. Webb and Bob Wentworth

DESCRIPTION OF THE PROBLEM:

DIE ATTACH:

  The carrier described herein is suited to handle a leaded, optical, surface mounted package. Many assembly process steps are required before attaching the die and prior to final electrical/optical testing of this package. Because of these process steps, han- dling damage to the package is high. Defects such as scratches of the light guides, bent leads and delam- ination can occur.

  The carrier would be loaded into the Die attach equipment, aligned, and flip chip bonded to the previously etched lead frame of the package. The carrier would be transferred to the "cure" oven for completion of the die attach process. Carrier would be molded of High temperature Pofyether Sulphone GE444 or equivalent material in order to withstand the cure temperature.

IMPROVEMENT AND APPLICATION:

UNDERFILL:

  The following process steps could be carried out with the unit "captured" in the carrier. Mechanical damage to the leadframe, and scratches to the opti- cal guides on this package would be eliminated.

  The flip chip bonded die (package still in car- rier) would be underfilled with the specified mate- rial and placed into the cure oven for the specified time.

OPTlCAL TEST:

ELECTRICAL TEST:

  The carrier would be designed to accept the pack- age after the trim form process. The package, at this point in the flow, would have been optically pol- ished but not...