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Browse Prior Art Database

Method for using posts attached to the IHS to mechanically lock the IHS to the package

IP.com Disclosure Number: IPCOM000007948D
Publication Date: 2002-May-07
Document File: 3 page(s) / 49K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for using posts attached to the integrated heatsink (IHS) to mechanically lock the IHS to the package. Benefits include improved thermal performance, improved process, and improved throughput.

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Method for using posts attached to the IHS to mechanically lock the IHS to the package

Disclosed is a method for using posts attached to the integrated heatsink (IHS) to mechanically lock the IHS to the package. Benefits include improved thermal performance, improved process, and improved throughput.

Background

              An epoxy sealant is conventionally used to attach the IHS to the package and to prevent the IHS from being removed during shock and vibration (see Figure 1).The IHS attach process, though conceptually simple, is a complicated process. A spring forces the IHS to the package, which is kept at an elevated temperature for curing the sealant material. Package warpage can occur during this step due to the interaction between the spring and the organic substrate at sealant-cure temperatures.

Description

              The disclosed method retains an IHS to a processor package using mechanical locking features (see Figure 2). The key elements are:

§         Posts on four corners of a flat IHS that mate with locking features attached to the substrate (see Figure 3)

§         Locking features (piece parts with locking features) mechanically attached or glued to the substrate

              Z-axis presses apply pressure on the IHS (with pre-applied TIM) to the package to force the posts on the lid into the mating features attached to the substrate (see Figure 4).

              Various types of locking features can be mounted on the substrate to capture the prong connected to the lid (see Figure 5).

Advantages

              The technical advantages of...