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Browse Prior Art Database


IP.com Disclosure Number: IPCOM000007956D
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2002-May-08
Document File: 2 page(s) / 76K

Publishing Venue


Related People

Garland D. Cotney: AUTHOR


Closest known prior art providing similar appli- cations are plastic molded wahle paks, and gel-paks.

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@Q Mo7vmoLA Technical Developments


by Garland D. Cotney

in current use today. Applications could be die stor- age and handling, small device storage, handling and shipping.


  The structure is a molded or die stamped open windowed plastic frame onto which a bottom cover of wafer tape is mounted with pressure. The struc- ture becomes an open windowed waffle pak with an adhesive tape bottom onto which die or other small products can be deposited on the tape for storage, handling, etc. The die can be removed from the windowed "Tape4%" with a die ejector mechanism. The standard mechanism currently used on Pick N' Place and die attach equipment would be acceptable.


Closest known prior art providing similar appli- cations are plastic molded wahle paks, and gel-paks.



  The "Tape-Pak" provides a reusable, adhesive bottom die or other small item storage and safe han- dling carrier. This is a fairly inexpensive carrier and storage in comparison to standard molded waEle paks

  The "Tape-Pak" allows needle ejection of the die out of the carrier. There is no change required to the standard die attachers and Pick N' Place equip- ment in order to make use of the "Tape-Pakl' The adhesive in the bottom prevents die movement in the storage cavity. This type of carrier is reusable and less expense than the current waffle paks used in the industry today.

0 Motorola. Inc. ,996 187

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