Browse Prior Art Database

HIGH PERFORMANCE CERAMIC QUAD FLAT PACKAGE (HPCQFP) WITH MULTILAYER BASE AND SURFACE PAD CONTACTS

IP.com Disclosure Number: IPCOM000007972D
Original Publication Date: 1997-Mar-01
Included in the Prior Art Database: 2002-May-09
Document File: 2 page(s) / 92K

Publishing Venue

Motorola

Related People

Paul Lin: AUTHOR [+2]

Abstract

Integrated circuit package designers are faced with the need to increase performance, such as higher number of I/OS, electrical and thermal, while reducing size and cost. Many of the advanced, high performance microprocessors arc sensitive to ground bounce and heat dissipation that are, in part, controlled by IC package design.

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MOTOROLA Technical Developments

HIGH PERFORMANCE CERAMIC QUAD FLAT PACKAGE (HPCQFP) WITH MULTILAYER BASE AND SURFACE PAD CONTACTS

by Paul Lin and Mike McShane

PROBLEM

  Integrated circuit package designers are faced with the need to increase performance, such as higher number of I/OS, electrical and thermal, while reducing size and cost. Many of the advanced, high performance microprocessors arc sensitive to ground bounce and heat dissipation that are, in part, controlled by IC package design.

SOLUTION:

  The HPCQFP has enhanced performance for thermal management, ground bounce and I/O densi- ty using cost effective piece parts and conventional high volume manufacturing processes. The HPC- QFP is a design solution that balances the perfor- mance and size tradeoffs by utilizing packaging technologies to provide power and ground contact pads on the multilayer ceramic base. (Fig. 1) Signal pins are connected to the leads, while power and ground pins are connected to pads on the base.

  An example is a 28 x 28 mm 308 HPCQFP hav- ing 208 peripheral leads with 100 power and ground pads on the base. Compared to the equivalent 40 x 40 mm 304 CQFP, both with 0.5 mm lead pitch, the 308 HPCQFP is more than 45% smaller. The dis- tance to neutral point (DNP) is reduced. Thermal performance is improved by soldering the HPCQFP

to the system board utilizing the power and ground pads to conduct heat from the die attach pad. Optimization of the overall system performance is a function of bo...