Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Method for a socket with wings

IP.com Disclosure Number: IPCOM000007977D
Publication Date: 2002-May-09
Document File: 4 page(s) / 46K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a socket with wings. Benefits include improved functionality and improved performance.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 50% of the total text.

Method for a socket with wings

Disclosed is a method for a socket with wings. Benefits include improved functionality and improved performance.

Background

              The high current required for high-power devices is conventionally generated on the printed circuit board (PCB) or motherboard (MB). The 1-oz. copper thickness used on a PCB is reaching its current-carrying capacity. Power devices use space that would be better utilized for computing rather than power delivery.

General description

              The disclosed method is an apparatus that integrates a PCB with thick (greater than 1 oz.) copper planes to a multipin socket. The thick copper planes provide a low-resistance path for the high currents to get to the appropriate microprocessor VCC and VSS pins or other high-current components installed in the socket. The integrated PCB has the input connector for the high-current circuitry (such as the voltage regulator). The integrated PCB contains decoupling capacitors or/and all the power-delivery components (such as controllers, drivers, and field-effect transistors) required to deliver power to a microprocessor or other component installed in the socket.

              A desktop (DT) motherboard (MB) with PCB layers utilizing 1-oz. copper planes supports future requirements because the high-current power delivery does not enter the main PCB or MB.

Advantages

              The disclosed method provides advantages, including:

§         Localized site for high current-carrying capacity

§         Thick copper planes (greater than 1 oz.) with direct connections to the appropriate power and ground pins (VCC and VSS) on the socket

§         High curr...