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Method for a self-crack-mending polymer for underfill technology in IC packaging

IP.com Disclosure Number: IPCOM000008061D
Publication Date: 2002-May-15
Document File: 3 page(s) / 151K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a self-crack-mending polymer for underfill technology in integrated circuit (IC) packaging. Benefits include improved reliability.

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Method for a self-crack-mending polymer for underfill technology in IC packaging

Disclosed is a method for a self-crack-mending polymer for underfill technology in integrated circuit (IC) packaging. Benefits include improved reliability.

Background

              Conventional underfill consists of ground silica-filled particulates in a polymer matrix compound.

              Fillet cracking is one of the major defects during thermal stressing of flip-chip components (see Figure 1). Conventionally this problem is solved by increasing the silica-filler loading to improve the fracture toughness of the material and slow down the crack formation. However, underfill materials are currently loaded up to 60%. Additional filler loading causes the materials not to flow, impacting the manufacturing process.

General description

      The disclosed method utilizes the application of a thermo-set polymer used as underfill for flip-chip packaging applications to self-mend cracks. The polymer is comprised of monomers contained in microcapsules. These components are dispersed in the polymer matrix.

Advantages

              The disclosed method provides advantages, including:

§         Improved robustness of underfill materials

§         Improved product reliability

Detailed description

              The disclosed method includes a thermo-set polymer used as underfill to self-mend cracks.  The innovation includes adding microcapsules that consists of monomer into the underfill material

              The main components of the polymer are the dicyclopentadiene (DCPD) monomers contained...