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Method for a silica-filled solder paste for BGA bumping

IP.com Disclosure Number: IPCOM000008062D
Publication Date: 2002-May-15
Document File: 4 page(s) / 347K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a silica-filled solder paste for ball grid array (BGA) bumping. Benefits include improved reliability.

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Method for a silica-filled solder paste for BGA bumping

Disclosed is a method for a silica-filled solder paste for ball grid array (BGA) bumping. Benefits include improved reliability.

Background

      Second-level interconnection solder joints are conventionally produced by placing solder spheres on the component’s pad (see Figure 1). With the help of flux, spheres are connected to the pad metallization via reflow process. The spheres are made of solder material. As second-level package interconnection bump pitch is reduced, solder joints can crack during thermal-cyclic stressing (see Figure 2). Conventionally, this problem is solved by carefully designing the ball grid layout and by increasing the component-to-board standoff.

              Silica reinforcement is not technologically feasible for the conventional manufacturing of solder spheres.

General description

      The disclosed method is the application of silica fillers in the solder paste used for BGA bumping as a replacement option to the solder-ball attachment process. The filler reinforcement increases the solder toughness, reducing fractures and increasing solder-joint reliability.

Advantages

              The technical advantages of the disclosed method include:

§         Increase in the product reliability lifetime by providing robustness to BGA bumps

§         Reduction in BGA pitch

§         Higher bump standoff using ball/bump-printing technology

Detailed description

              The disclosed method is silica-filled solder paste used as bumps for second-level interconnection (see...