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Method for a low-cost integrated development tool for wafer taping, mounting, and detaping

IP.com Disclosure Number: IPCOM000008063D
Publication Date: 2002-May-15

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a low-cost integrated development tool for wafer taping, mounting, and detaping. Benefits include improved functionality, reduced defects, and improved reliability.

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Method for a low-cost integrated development tool for wafer taping, mounting, and detaping

Disclosed is a method for a low-cost integrated development tool for wafer taping, mounting, and detaping. Benefits include improved functionality, reduced defects, and improved reliability.

Background

              The noncontact vacuum chuck concept typically applied in wafer mounting systems is unsuitable for ultra-thin wafers less than 7 mils thick. Ultra-thin wafers are very fragile. Their mechanical characteristics are highly influenced by several factors, including:

§         Thickness

§         Metal layers

§         Die size

§         Silicon back-grinding process

              Optimized chuck tension is extremely difficult to achieve, sometimes leading to lamination and wafer cracking.

              High cost, complex design and dedicated tool designs for different processes are unfavorable elements in a low-volume manufacturing environment.

              A conventional wafer mounter with a contactless vacuum chuck requires extensive optimization to support ultra-thin wafer application. As different wafer thickness and metal layers contribute to significant difference in terms of flexibility and strength, dedicated chuck settings are necessary. This approach is feasible but lacks process robustness.

              A conventional backgrind taping tool (less than 7 mils thickness) does not adjust the tape tension. Below 7 mils thickness, post-backgrind wafer warpage is a proven key factor that can cause wafer cracks. The chuck table height relative to its surrounding platform has been proven to influence tape tension during the lamination process. While a conventional taping tool offers limited or no adjustment capability to the table, hardware modification is often required.

General description

              The disclosed method is a semiautomated piece of equipment designed for backgrind tape lamination, thin wafer frame mounting, and the backgrind tape removal process. It has features that are flexible for multiple wafer tape lamination process characterization. The method also meets low-capacity manufacturing requirements.

              This tool is simple and flexible enough to support backgrind taping, frame mounting, and backgrind detaping processes. Critical parameters are easily set for process characterization.

              The key elements of the method include:

§         A variable speed controlled vacuum chuck table with a self-tensioning (spring-loaded) tape feeding mechanism, ensuring consistent speed during tape...